Development and Manufacturing

The circuit board is an essential component of modern electronic products, and its quality and design directly affect the performance and reliability of the entire electronic device. This article will introduce the development and manufacturing stages of circuit boards and describe in detail the content of each step.

Stage One: Schematic and PCB Design 

In the first stage of circuit board manufacturing, it is necessary to write a schematic based on the functional requirements of the electronic product and convert it into a PCB design file. Attention should be paid to the performance indicators and reliability requirements of the circuit, and the size and shape of the PCB board should be planned according to the circuit layout and the position of the components.

Stage Two: Component Procurement and Pre-processing 

After completing the PCB design, the required components need to be purchased and pre-processed. The packaging method and pin position of different components need to be consistent with the design in the PCB. The surface of the components needs to be stripped of oxides and meet the welding requirements.

Stage Three: PCB Printing 

After completing the PCB design and component preparation, it is necessary to print the PCB pattern onto the copper foil, and then conduct etching and other processing steps. Finally, it is processed into the required shape and size of the PCB board.

Stage Four: Surface Mount Technology (SMT) Assembly 

On the printed circuit board, the components need to be surface-mounted and soldered using SMT technology.

Stage Five: Dual Inline Package (DIP) Assembly 

For certain interface designs for specific circuit requirements, some components need to be linked to the circuit via DIP plug-ins. This step is called DIP assembly.

Stage Six: Testing and Debugging 

When all components are completed, testing and debugging can be performed to verify if the circuit board meets requirements.